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Best viewed @ 1024 x 768 and higher
Introduction:
Memory kits seem to annually
receive some modifications in design and the types of ICs used to build the
kits. At various times throughout a module's history, the kits also receive face
lifts. While most users are mainly concerned with the ICs under the heat
spreaders, they do give a bit of weight to the look of the kit.
9th
April, 2008 G.Skill International Enterprise, a leading provider of high performance memory, today announced the new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "PI" series heat spreader design increases the air contact surface 100% more than traditional design.
Lower Temperature = Lower Power Consumption All users are pursuing higher system performance. Memory frequency is one of the key factors. According to the theory, higher memory frequency takes higher power consumption as the higher Vdimm needed. G.Skill "PI" series heat spreader design takes more heat out from the memory IC surface. It can lower the temperature at least 20% to 30% more than the traditional design.
Lower Temperature = More
System Performance For Overclockers, every degree is also the matter. As per semiconductor characteristic, too high temperature will limit the working frequency, OC capability, and product life. G.Skill "PI" series heat spreader design allows overclockers to squeeze their memory performance more than the past. For the serious gamers, they can avoid be killed dues to the system lag.G.Skill "PI" series product list
This module will be available through G.Skill’s authorized resellers and distributors worldwide. For more information and specifications on the new "PI" series products, please visit the "Product" section.
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